description the HSMF-C118 tricolor chip-type led is designed in an ultra small package for miniaturization. it is the first of its kind to achieve such small packaging for 3 dies. with the freedom to have any combination of colors from mixing of the 3 primary colors, this will yield a wide variety of colors to suit every application and product theme. agilent HSMF-C118 tricolor chipled data sheet features common anode small 3.2 x 2.7 x 1.1 mm package diffused optics red/green/blue color combination available in 8 mm tape on 7 inch (178 mm) diameter reels high brightness using alingap and ingan die technology compatible with reflow soldering applications backlighting status indicator front panel indicator office automation, home appliances, industrial equipment caution : HSMF-C118 is class 1 esd sensitive per mil-std-1686. please observe appropriate pre- cautions during handling and processing. refer to agilent technologies application note an-1142 for additional details. the small size, narrow footprint, and low profile make this led excellent for back-lighting, status indication, and front panel illumination applications. in order to facilitate pick and place operation, this chipled is shipped in tape and reel, with 3000 units per reel. the package is compatible with ir soldering and binned by both color and intensity.
2 package dimensions 3.2 (0.126 ) 0.5 (0.020) 0.7 (0.028) 0.6 (0.024) common anode 1.1 (0.043) 2.0 (0.079) 1.5 (0.059) led die diffused epoxy pc board 2.7 (0.106) 1.1 (0.043) notes: 1. dimensions in millimeters (inches). 2. tolerance 0.1 mm unless otherwise noted. 3 2 1 4 anode mark 1 2 4 3 red blue green polarity 0.4 (0.016) 4 ? 0.05 (0.002) soldering terminal
3 electrical characteristics at t a = 25?c reverse breakdown capa citance thermal forward voltage v r (volts) c (pf), @ v f = 0, resistance v f (volts) @ i f = 20 ma @ i r = 100 a f = 1 mhz r j-pin (?c/w) color typ. max. min. typ. typ. alingap red 1.9 2.4 5 17 400 ingan green 3.5 3.9 5 110 450 ingan blue 3.5 3.9 5 110 450 absolute maximum ratings at t a = 25?c parameter alingap red ingan green ingan blue units dc forward current [1, 3, 4] 20 20 20 ma power dissipation [1] 48 78 78 mw dc forward current [2] 15 15 15 ma power dissipation [2] 36 59 59 mw reverse voltage (i r = 100 a)55 5v led junction temperature 95 95 95 ?c operating temperature range ?0 to +85 ?c storage temperature range ?0 to +85 ?c soldering temperature see reflow soldering profile (figures 6 & 7) notes: 1. applies when single led is lit up. 2. applies when all 3 leds are lit up simultaneously. 3. derate linearly as shown in figure 4. 4. drive currents above 5 ma are recommended for best long term performance. optical characteristics at t a = 25?c color, peak dominant luminous luminous intensity wavelength wavelength viewing angle efficacy i v (mcd) @ i f = 20 ma [1] peak (nm) d [2] (nm) 2 1/2 degrees [3] v (lm/w) color min. typ. typ. typ. typ. typ. alingap red 28.5 90 637 626 135 155 ingan green 45.0 120 523 525 130 490 ingan blue 11.2 40 468 470 125 80 notes: 1. the luminous intensity, i v , is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2. the dominant wavelength, d , is derived from the cie chromatically diagram and represents the perceived color of the device. 3. 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. caution: 1. the above optical performance specifications are valid in the case when single led is lit up. 2. the above product specifications do not provide any guarantee on color mixing, color consis- tency over time, or uniformity in luminous intensity when more than 1 led is lit. 3. please refer to agilent technologies? application brief ab d-007 for additional details/explanation on driving the part in parallel circuit.
4 figure 2. forward current vs. forward voltage. intensity (i v ) bin limits [1] intensity (mcd) bin id min. max. l 11.20 18.00 m 18.00 28.50 n 28.50 45.00 p 45.00 71.50 q 71.50 112.50 r 112.50 180.00 s 180.00 285.00 tolerance: 15%. figure 1. relative intensity vs. wavelength. figure 3. luminous intensity vs. forward current. blue color bins dom. wavelength (nm) bin id min. max. a 460.0 465.0 b 465.0 470.0 c 470.0 475.0 d 475.0 480.0 tolerance: 1 nm red color bins dom. wavelength (nm) bin id min. max. 615.0 630.0 tolerance: 1 nm green color bins dom. wavelength (nm) bin id min. max. a 515.0 520.0 b 520.0 525.0 c 525.0 530.0 d 530.0 535.0 tolerance: 1 nm color bin limits [1] note: 1. bin categories are established for classifi- cation of products. products may not be available in all categories. please contact your agilent representative for information on currently available bins. 100 10 1 0.1 1.5 2.5 3.5 4.0 v f ? forward voltage ? v i f ? forward current ? ma 3.0 2.0 green & blue red 05 15 i f ? forward current ? ma 0 0.4 1.4 luminous intensity (normalized at 20 ma) 30 0.8 0.2 1.0 10 0.6 1.2 green, blue 20 25 red figure 4. maximum forward current vs. ambient temperature (1 chip lit up). 0 25 0 20 60 80 5 i f max. ? maximum forward current ? ma t a ? ambient temperature ? c 40 15 20 10 10 30 50 70 9 0 as red green, blue 400 100 0 600 700 20 relative intensity 500 60 40 80 450 550 650 10 50 30 70 90 ingan blue ingan green as red
5 figure 5. relative intensity vs. angle. relative intensity ? % 1.0 0 angle 0.8 0.6 0.5 0.7 0.2 0.1 0.3 0.4 0.9 -70 -50 -30 0 20 30 50 70 90 -90 -20 -80 -60 -40 -10 10 40 60 80 red blue green figure 7. recommended pb-free reflow soldering profile. figure 8. recommended soldering pattern. 1.0 (0.039) 1.5 (0.059) 1.5 (0.059) 2.0 (0.079) 1.0 (0.039) 0.4 (0.016) 230? max. 10 sec. max. 4?/sec. max. over 2 min. time temperature 4?/sec. max. 140-160? ??/sec. max. 217 ? max. 120 sec. 6 ?/sec. max. 3 ?/sec. max. 140 - 160 ? 255 ? (+5/-0) 60 to 150 sec. 10 to 20 sec. temperature figure 6. recommended pb-free reflow soldering profile.
6 figure 9. reeling orientation. figure 10. reel dimensions. x x x x x x x x x x x x x x x x x x x x cathode side printed label user feed direction x x x x x 10.50 ?1.0 (0.413 ?0.039) 59.60 ?1.00 (2.346 ?0.039) 20.20 min. ( 0.795 min.) 6 ps 178.40 ?1.00 (7.024 ?0.039) 3.0 ?0.5 (0.118 ?0.020) 4.0 ?0.5 (0.157 ?0.020) 5.0 ?0.5 (0.197 ?0.020) 13.1 ?0.5 ( 0.516 ?0.020) 8.0 ?1.0 (0.315 ?0.039)
7 figure 11. tape dimensions. figure 12. tape leader and trailer dimensions. note: 1. all dimensions in millimeters (inches). convective ir reflow soldering for more information on ir reflow soldering, refer to application note 1060, surface mounting smt led indicator components . storage condition: 5 to 30?c @ 60% rh max. baking is required under the condition: a) the blue silica gel indicator becoming white/transparent color b) the pack has been opened for more than 1 week baking recommended condition: 60 5?c for 20 hours. end start there shall be a minimum of 160 mm (6.3 inch) of empty component pockets sealed with cover tape. mounted with components. there shall be a minimum of 160 mm (6.3 inch) of empty component pockets sealed with cover tape. minimum of 230 mm (9.05 inch) may consist of carrier and/or cover tape. 8.00 ?0.30 (0.315 ?0.012) user feed direction dim. a (see table 1) 3.50 ?0.05 (0.138 ?0.002) 1.75 (0.069) dim. c (see table 1) 0.20 ?0.05 (0.008 ?0.002) carrier tape cover tape dim. b (see table 1) 4.00 (0.157) 2.00 ?0.05 (0.079 ?0.002) 4.00 (0.157) 1.50 (0.059) table 1 dimensions in millimeters (inches) cathode dim. a ?0.10 (?0.004) dim. b ?0.10 (?0.004) part number dim. c ?0.10 (?0.004) HSMF-C118 3.52 (0.139) 3.02 (0.119) 1.40 (0.055)
www.agilent.com/semiconductors for product information and a complete list of distributors, please go to our web site. for technical assistance call: americas/canada: +1 (800) 235-0312 or (916) 788-6763 europe: +49 (0) 6441 92460 china: 10800 650 0017 hong kong: (+65) 6271 2451 india, australia, new zealand: (+65) 6271 2394 japan: (+81 3) 3335-8152(domestic/interna- tional), or 0120-61-1280(domestic only) korea: (+65) 6271 2194 malaysia, singapore: (+65) 6271 2054 taiwan: (+65) 6271 2654 data subject to change. copyright ?2004 agilent technologies, inc. obsoletes 5988-6892en october 29, 2004 5989-1277en
|
